Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.
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Summary:
Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.
With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.
Specifications
Product name | LBEE5WV2GF |
---|---|
Type | Type 2GF |
IC manufacturer | Infineon |
IC product name | CYW43022 |
Technology | Wi-Fi® and Bluetooth® |
Wi-Fi® | Wi-Fi 5 (802.11ac) |
Wi-Fi® frequency band | 2.4 GHz and 5 GHz |
Bluetooth® | 5.4 BR/EDR/Low Energy |
Host interface (Wi-Fi®) | SDIO |
Host interface (Bluetooth®) | UART |
Built-in antenna | None |
Dimension | 10.0 x 7.2 x 1.5 mm |
Supply voltage | 3.2 to 4.6 V |
Interfacing voltage | 1.8V |
ISED (radio communication regulation for Canada) certification | Certified |
FCC (radio communication regulation for the U.S.) certification | Certified |
ETSI (radio communication regulation for Europe) report | Prepared |
Japan Radio Law certification | Certified |
Operating temperature range (℃) | -20℃ to 70℃ |
From Murata Web